Apr. 20, 2020
Taiyo Nippon Sanso is sponsoring and presenting at AngelTech Online Summit on May 19th, which is bringing together the global Compound Semiconductor Industry to learn, network, interact and create new business opportunities - digitally. There is no cost to register.
Oral Presentation
●Session: CS International
●Topic: GaN MOCVD Solutions
●Date: May 19 (Tue)
Abstract:
5G wireless communications, electric vehicles, and advanced automotive lighting applications offer many opportunities for compound semiconductor devices. Whether the application requires power diodes, high frequency transistors, or laser chips, high quality and high throughput MOCVD processes are essential. Taiyo Nippon Sanso Corporation (TNSC) was the first to develop MOCVD equipment in 1983 and has developed many innovations that allow for fast growth of thick, high quality (Al,In)GaN films, which in turn enable high throughput cost effective MOCVD processes. This presentation will highlight key advantages of TNSC’s MOCVD equipment and TNSC’s full-end to end solution for compound semiconductor manufacturers."